AOI / Testing Systems / GÖPEL

Göpel X-Line 3D L9181-02

[Translate to Englisch:] Göpel X-Line 3D L9181-02

Description:

Automatic X-Ray Inspection
For Inspection of BGA-, QFN-, THT-, LED-, LGA- and other soldering joints, visible and hidden.

Further:

  • incl. Offline Station and Repair Station
  • OS: Windows 7
  • Ultra-High Speed Line-Scan CCD Detectors
  • Inspection Area: 450 mm - 400 mm
  • Image: 2D, 2,5D, 3D (stratified pictures by planar CT)
  • PCB size: 60 - 450 x 50 - 400 mm
  • AXI-Resolution: 6 - 30 µm / Px
  • AOI:
  • Field of View Camera: 42 mm x 42 mm
  • Resolution: 21 µm
  • Inspection height: -3 bis 7,5 mm
  • Optic: telecentric
  • Transportation height: 950 mm +/- 25 mm
  • Interface: SMEMA
  • Width adjustment: automatic
Price on request
Facts:
Art. No.:12898
Manufacturer:GÖPEL
Construction year:2016
Amount:1 Piece
Weight:2.600 kg
Dimensions:1.596 x 1.540 x 1.720 mm

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